Blogs

Koby's Kaos

The Future in 4D
blogger

The sleigh is ready, the presents packed, it’s the futures I’m worried about. Less wires, more batteries, the first...

Stan on Standards

Get Ready 'Cause Here It Comes: Accellera Systems Initiative Day @ DVCon
blogger

Lots of ink has been spilt (in a good cause) in reporting on the new Accellera Systems Initiative organization.  However...

Wizards of Microwave

My Interview on EE Web
blogger

EE Web interviewed me for their "Featured Engineer" series. The interview is posted here: Featured Engineer: Colin...

Tuning into Jim

Dim View of a Bright Idea
blogger

Many of you already know about the apparent future of incandescent light bulbs in the United States. With the passage of...

Pallab's Place

Interfaces dominate CES IP
blogger

At the 2012 CES conference, there were many IP providers mixed in amongst the many end product companies. These IP...

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iDesign - Providing the advanced IC Design market access to high-value information and essential tools.

Startup Packet Plus Rolls Embedded Debugger by Mark LaPedus
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Technology speeds up product development times
Silicon Replacements - Equal measures of fact... by Lou Covey, Editorial Director Footwasher Media
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Over the past decade, there have been several breathless announcements about a material that is destined to become the...
Samsung Joins Mobile Chip Venture in Japan by Mark LaPedus, SemiMD senior editor
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Baseband market sees new twist at Docomo

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Focus Reports

  • MEMS and Packaging Hold Keys to Radio Connectivity
    Building on Intel’s Rattner introduction to the future of mobile computing, IMEC’s Liebet Van der Perre recently spoke about the need for ultra-low-power, ultra-high-speed, versatile radios. Dr. Van der Perre is the director of the Green Radios Program at IMEC. What follows is a summary of her presentation.
  • Globalfoundries Confronts Issues and Plans Ahead
    While the theme of collaboration was the same, the discussions at this year’s Globalfoundries GTC2011 event focused on supporting legacy nodes, acknowledging present challenges at 32nm and moving ahead to 28nm and 20nm with a strong ecosystem of partners.
  • Sonics and Others Evolve On-Chip Interconnections
    Connecting a multitude of internal and third party IP requires ever advancing on-chip bus technology from big players like ARM, OCI-IP and INTEL as well as startups like Arteris and Sonics.
  • EDA Inflections on Technology Innovations
    Each of the major semiconductor EDA companies approaches innovation is different ways, but all agree that creating new products and improving existing ones is essential to survival.

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