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bloggerCarbon Footprint is Good For ICs

IBM just demonstrated graphene transistors that could become a replacement for pure silicon-based ICs. | Photo...

JB's Circuit

bloggerGoing Beyond and Returning to Reusability

Design for the Consumer Era is seen as the next iteration of the infamous Design-for-X paradigm shift by keynote presenter at...

Taken For Granted

bloggerDATE 2010 Preview

The Design Automation and Test in Europe 2010 conference will be held in Dresden Germany from March 8 to 12. DATE...

Pallab's Place

bloggerNetwork ICs - packaging is a key design element

I recently had a chance to have a conversation with Judy Priest of Cisco about some of the design and packaging issues for...

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J B ' s   C i r c u i t

Going Beyond and Returning to Reusability ( 2-5-10 )

Design for the Consumer Era is seen as the next iteration of the infamous Design-for-X paradigm shift by keynote presenter at DesignCon 2010. One seldom hears anything new or earthshaking at keynot...

T a k e n    F o r    G r a n t e d

DATE 2010 Preview ( 2-5-10 )

The Design Automation and Test in Europe 2010 conference will be held in Dresden Germany from March 8 to 12. DATE has always been a favourite conference of mine to attend, with its excellent te...

E D A    T h o u g h t s

Carbon Footprint is Good For ICs ( 2-5-10 )

IBM just demonstrated graphene transistors that could become a replacement for pure silicon-based ICs. | Photo: Courtesy of IBM, posted at EE Times The demonstration showed 100GHz operation at ...

W i z a r d s    o f    M i c r o w a v e

Using EM to Design DGS Structures ( 2-1-10 )

A Defective Ground Structure (DGS) is an intentionally designed defect on a ground plan, which creates additional effective inductance and capacitance.  This technique can be used to design microstri...

T u n i n g   I n t o   J i m

Going, Going, Almost Gone ( 1-19-10 )

There has been a trend over the past several years in the electronics community. It has been driven by the dismal economy along with the rise of social networking. I am referring to the diminishing ...

P a l l a b ' s   P l a c e

Network ICs - packaging is a key design element ( 2-5-10 )

I recently had a chance to have a conversation with Judy Priest of Cisco about some of the design and packaging issues for accepting and qualifying new SOCs for high speed networking applications.  H...
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