GLOBALFOUNDRIES Fab 8 Adds Tools to Enable 3D Chip Stacking at 20nm and Beyond
Si2 Announces “Si2 Roundup@DAC: Standards in Action”
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Si2 Roundup @ DAC: Standards in Action
If you are attending DAC this year, or still thinking about it, then read on -- you will not want to miss out on all the...
Taken For Granted
Whither Design in Europe?
Last week I was able to attend DATE 2012 in Dresden, Germany. I was in conversation with a colleague who asked me what I...
Tuning into Jim
Mobile Devices Facing the Battery Gap
The semiconductor industry is often described in terms of ‘gaps’ between two or more parametrics. With the rapidly...
JB's Circuit
Low-Power Undercurrents at GlobalPress 2012
While not the primary theme at this year’s Globalpress eSummit 2012, low power concerns were present in almost every...
Real Talk from Real Intent
- Gabe on EDA: Real Intent Helps Designers Verify Intent
- EDACafe: A Page is Turned
- Press Release: Graham Bell Joins Real Intent to Promote Early Functional Verification & Advanced Sign-Off Circuit Design Software
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- Article: Blindsided by a glitch
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Power Forward Initiative Publishes On-Line Guide to Low-Power Design with the Common Power Format
As the electronics industry moves toward advanced CMOS process geometries at 65nm and below, considerable power management challenges have emerged that cannot be met by a desig ...
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Hummingbird®: Pushing the Limits of Cadence Applications and Exceed UsersHummingbird
MunEDA WiCkeD™: Improve Design Performance and YieldMunEDA
EDAConnect-SiPPerception Software
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