Blogs

Pallab's Place

bloggerNetwork ICs - packaging is a key design element

I recently had a chance to have a conversation with Judy Priest of Cisco about some of the design and packaging issues for...

Taken For Granted

bloggerDATE 2010 Preview

The Design Automation and Test in Europe 2010 conference will be held in Dresden Germany from March 8 to 12. DATE...

EDA Thoughts

bloggerCarbon Footprint is Good For ICs

IBM just demonstrated graphene transistors that could become a replacement for pure silicon-based ICs. | Photo...

JB's Circuit

bloggerGoing Beyond and Returning to Reusability

Design for the Consumer Era is seen as the next iteration of the infamous Design-for-X paradigm shift by keynote presenter at...

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Cadence Interoperability Guide

CADENCE INTEROPERABILITY GUIDE


Articles

Power Forward Initiative Publishes On-Line Guide to Low-Power Design with the Common Power Format

As the electronics industry moves toward advanced CMOS process geometries at 65nm and below, considerable power management challenges have emerged that cannot be met by a desig ...

By: Susan Runowicz-Smith, Group Director, Cadence Design Systems, Power Forward Initiative



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For e and SystemVerilog Development

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Apache Design Solutions

ENOVIA Synchronicity DesignSync DFIII

Dassault Systèmes

eInfochips releases highly configurable, URM compliant HDMI UVC for verification of HDMI compliant devices

einfochips

Hummingbird®: Pushing the Limits of Cadence Applications and Exceed Users

Hummingbird

MunEDA WiCkeD™: Improve Design Performance and Yield

MunEDA

EDAConnect-SiP

Perception Software

PLDA - Premier PCIe IP Products featuring Support for Cadence Tools

PLDA

Semiconductor IP Solutions

Virage Logic Corporation

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