Network ICs - packaging is a key design element
I recently had a chance to have a conversation with Judy Priest of Cisco about some of the design and packaging issues for...
DATE 2010 Preview
The Design Automation and Test in Europe 2010 conference will be held in Dresden Germany from March 8 to 12. DATE...
Carbon Footprint is Good For ICs
IBM just demonstrated graphene transistors that could become a replacement for pure silicon-based ICs. | Photo...
Going Beyond and Returning to Reusability
Design for the Consumer Era is seen as the next iteration of the infamous Design-for-X paradigm shift by keynote presenter at...
CADENCE INTEROPERABILITY GUIDE
As the electronics industry moves toward advanced CMOS process geometries at 65nm and below, considerable power management challenges have emerged that cannot be met by a desig ...
By: Susan Runowicz-Smith, Group Director, Cadence Design Systems, Power Forward InitiativeAMIQ
Sentinel: Power, Noise, Reliability Platform for Chip-Package-System Co-DesignApache Design Solutions
ENOVIA Synchronicity DesignSync DFIIIDassault Systèmes
eInfochips releases highly configurable, URM compliant HDMI UVC for verification of HDMI compliant deviceseinfochips
Hummingbird®: Pushing the Limits of Cadence Applications and Exceed UsersHummingbird
MunEDA WiCkeD™: Improve Design Performance and YieldMunEDA
EDAConnect-SiPPerception Software
PLDA - Premier PCIe IP Products featuring Support for Cadence ToolsPLDA
Semiconductor IP SolutionsVirage Logic Corporation
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