• Press Release: Over 35% Revenue Growth in First Half of 2012
• Thoughts on RTL Lint, and a Poem
• Real Intent is #8 on Gary Smith’s “What to see at DAC” List!
• Gabe on EDA: Real Intent Helps Designers Verify Intent
• EDACafe: A Page is Turned

• LTE-Advanced Signal Generation and Measurement Using SystemVue

• Linking Early Mechatronic System Analysis to Physical Testing

• Best Practice Development Processes for Medical Device FPGAs

• Direct Power MOSFET Capacitance Measurement at 3000 V

• Common Pitfalls in PCI Express Design

• Increasing Revenue Through Continuously Optimized Data Center Management

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• The Next SoCs
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• Editor's Note: The Next Frontiers
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• Power Model Complexity Grows
• Material Effects: Trading Performance For Power
• Low Power Dominates CES
• Editor's Note: Technology Crossover Ahead
• Absolute Power: 4G LTE vs. 3G

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• Applied Tips Restructuring Plan in Solar and LED Units
• Micron Confirms Acquisition Talks With Elpida
• Microsoft to Join 3D TSV DRAM Consortium
• Editor's View: Training Technicians, Hudson Valley Style
• Semico Spin: Forecasting Wafer Demand: Technology Migration, Bottlenecks and Confetti

Sponsored by:

• Chip Design Resource Catalog
• Chip Design Buyers' Guide
• Interoperability Guides
  • Cadence and Third-Party Solutions Guide
  • Mentor Graphics Vanguard Partner Interoperability Guide
  • OCP IP Member Guide
  • Synopsys - Focus on Interoperability
• IP Solutions Resource Catalog
• Valuable Resources
  • AdvancedTCA
  • DSP
  • FPGA and CPLD Resource Catalog
  • MIPS ® Embedded Resource Catalog
  • Multicore
  • PCI Express

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