Blogs

Wizards of Microwave

bloggerUsing EM to Design DGS Structures

A Defective Ground Structure (DGS) is an intentionally designed defect on a ground plan, which creates additional effective...

JB's Circuit

bloggerGoing Beyond and Returning to Reusability

Design for the Consumer Era is seen as the next iteration of the infamous Design-for-X paradigm shift by keynote presenter at...

Pallab's Place

bloggerNetwork ICs - packaging is a key design element

I recently had a chance to have a conversation with Judy Priest of Cisco about some of the design and packaging issues for...

EDA Thoughts

bloggerCarbon Footprint is Good For ICs

IBM just demonstrated graphene transistors that could become a replacement for pure silicon-based ICs. | Photo...

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Chip Design eNewsletters

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Complementing Chip Design magazine, this e-newsletter covers the latest developments in the world of chip design and test. All aspects of chip modeling, architecture, design, test and manufacture are covered, from EDA tools to digital and analog hardware issues. Other coverage areas include hard and soft IP - for both hardware and software, design and test methodologies, current technologies and ever-shift standards.


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IP Designer & Integrator

Semiconductor intellectual property cores, or IP, are more than just reusable units of chip design. They are constantly expanding libraries of great ideas that enable designers to efficiently build on the success of others. They make today's rapid development of ASICs, FPGAs and SoCs possible. Our role is to provide the best IP news, opinions, and articles available. Our goal is to help you become the smartest, fastest, most effective designer you can be.


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Programmable devices continue their rapid growth into consumer and communication markets. Designers need to stay on top of the latest trends - from ASIC prototyping and verification to FPGA-based product designs and video/audio applications using the latest programmable fabrics. PLD Designer covers these topics from the designer's standpoint with technical articles, well-known bloggers, exclusive survey trends data and videos.


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As the world's demand for mobile, wireless products continue to grow, more chip designers are faced with the challenges of integrating analog mixed signal and RF functionality into silicon. This e-newsletter will keep those system architects, designers, test engineers and their managers abreast of the latest product and technology advances in analog, RF-Wireless and mixed signal designs.


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