Si2 Announces “OPS Comes to Life” Session for Si2 Roundup@DAC
OCP-IP Releases New Compliance Document into Member Review
OCP-IP Releases OCP 3.1 Specification into Member Review
Accellera Systems Initiative Hosts User Events at the 2012 Design Automation Conference
OCP-IP Delivers Enhanced Transaction Generator Package
GSA Reports an Increase in April Semiconductor Funding Activity
Si2 Announces New Session for “Si2 Roundup@DAC”
GLOBALFOUNDRIES Fab 8 Adds Tools to Enable 3D Chip Stacking at 20nm and Beyond
Si2 Announces “Si2 Roundup@DAC: Standards in Action”
GSA Reports A Decrease in March Semiconductor Funding Activity
GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer
IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab
The romance between hardware and software sours, then sweetens after a "three-some". But no divorce is planned. - Review by...
On April 23, 2012 Intel introduced their new Ivy Bridge Core processors for the desktop, All In One (AIO) and traditional...
DOT.ORG
Get the Lowdown on Accellera’s VIP and UVM
[ Published in Spring 2011 issue of Chip Design Magazine ]When Do Standards Matter Most To Your Business?
[ Published in Winter 2011 issue of Chip Design Magazine ]UVM: Extending Standardization from Language to Methodology
The well-proven OVM base and the rich history of EDA standards development have built a firm foundation for the future. [ Published in October / November 2010 issue of Chip Design Magazine ]Tomorrow’s Wireless Communication Requires Higher Throughput and a Smaller Energy Budget
[ Published in June / July 2010 issue of Chip Design Magazine ]POWER Architecture ISA 2.06’s Stride N Prefetch Engines Boost Application Performance
[ Published in February / March 2010 issue of Chip Design Magazine ]60-GHz Communication: A Total Makeover
[ Published in October / November 2009 issue of Chip Design Magazine ]Accellera Technical Sub-Committee Enables VIP Interoperability and Reuse
[ Published in July / August 2009 issue of Chip Design Magazine ]Model OCP Interfaces in SystemC
Standards are being built on top of OSCI’s TLM-2 technology. [ Published in April / May 2009 issue of Chip Design Magazine ]Industry Standards Should Facilitate Multicore Adoption
[ Published in January / February 2009 issue of Chip Design Magazine ]GSA Mixed-Signal/RF Subcommittee Is Facilitating an Analog Ecosystem
[ Published in October / November 2008 issue of Chip Design Magazine ][Dot.org] The Second Commandment for Effective Standards
[ Published in April / May 2008 issue of Chip Design Magazine ][DOT.ORG] Margin Myopia Blurs Chip Supply-Chain Future
[ Published in March 2008 issue of Chip Design Magazine ][Dot.org] Debug Grows Increasingly Critical
[ Published in January / February 2008 issue of Chip Design Magazine ][ Dot.Org ] Kick-Starting RTL Power-Aware Verification
[ Published in October / November 2007 issue of Chip Design Magazine ][ Dot.Org ] The Unified Power Format -- A Standard Done the Right Way
[ Published in August / September 2007 issue of Chip Design Magazine ][ Dot.Org ] Integration and Power Highlight Latest Standards
[ Published in June / July 2007 issue of Chip Design Magazine ][ Dot.Org ] Power To The People
Power.org Grows with Major Players [ Published in April / May 2007 issue of Chip Design Magazine ][ Dot.Org ] EDA Standards: Have We Learned Our Lessons?
[ Published in February / March 2007 issue of Chip Design Magazine ][ Dot.Org ] In Search of the Holy Grail: Making Chips Cost Effective, Power Efficient, and Faster
[ Published in December 2006 / January 2007 issue of Chip Design Magazine ]Time To Market Drives SoC Design To Higher Levels Of Abstraction
[ Published in October / November 2006 issue of Chip Design Magazine ]DOT.ORG: SystemVerilog: The Front Wave of Success
[ Published in June / July 2006 issue of Chip Design Magazine ]DOT.ORG: Introducing CEDA: An Organization for the CAD Community
[ Published in April / May 2006 issue of Chip Design Magazine ]DOT.ORG: Security: It's Not Just Encryption
[ Published in February / March 2006 issue of Chip Design Magazine ]It's Been A Busy Year for EDA and Semicon Organizations
[ Published in December 2005 / January 2006 issue of Chip Design Magazine ]Aggregation Drives Successful IP Reuse
By helping IP providers and integrators assess IP quality, aggregators can ensure reusability while minimizing customer modification for different chips. [ Published in Aug / Sept 2005 issue of Chip Design Magazine ]SPIRIT: Structure for Packaging, Integrating, and Re-Using IP within Tool Flows
By looking to quickly produce usable IP-integration standards for SoC development, this organization has achieved many of its original goals. [ Published in April / May 2005 issue of Chip Design Magazine ]Si2: Innovation Through Collaboration
Flexibility is showing the organization a new way to help EDA and semiconductor companies address [ Published in December / January 2005 issue of Chip Design Magazine ]PCI-SIG: Several Years of Innovation
Both 2003 and 2004 are proving to be prolific years for the organization [ Published in October / November 2004 issue of Chip Design Magazine ]Dot.Org--The Metrics of Success
[ Published in July / July 2004 issue of Chip Design Magazine ]Dot.Org--Open Core Protocol: The SystemC Models
The System Level Design Working Group producestransactional models for the OCP 2.0 specification [ Published in April / May 2004 issue of Chip Design Magazine ]Dot.Org--Addressing the IP Quality Problem
FSA and VSIA link hands to tackle the issue [ Published in February / March 2004 issue of Chip Design Magazine ]Dot.Org--A Fresh Look at the New Si2
Working to generate standards that add value to the industry. [ Published in December / January 2004 issue of Chip Design Magazine ]
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