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Posts Tagged ‘chip-package-system’

Technologies For Power, Signal, Thermal, And EMI Sign-Off

Thursday, May 9th, 2013

This paper discusses the challenges associated with designing smaller, faster, and lower cost products. It provides an overview of Apache’s power and noise solutions and how these products enable comprehensive chip-package-system convergence flow across multiple design disciplines.

To download this white paper, click here.

Optimizing Cost-Performance-Schedule With A Chip-Package-System (CPS) Methodology

Thursday, April 11th, 2013

To meet smart device requirements with high levels of sophistication from an exceedingly small device running off a battery, the underlying electronics must evolve at a rapid pace.

To read more, click here.

ANSYS And Apache Technologies For An Integrated Chip-Package-System Flow

Thursday, January 17th, 2013

This paper presents solutions for effectively managing design specifications (performance) and margins (price). It discusses solutions based on accurate and predictive simulation software from ANSYS and Apache that offers electronics designers a simulation-driven chip–package–system convergence methodology.

To download this white paper, click here.

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