Part of the  

Chip Design Magazine

  Network

About  |  Contact

Posts Tagged ‘power sign off’

Technologies For Power, Signal, Thermal, And EMI Sign-Off

Thursday, May 9th, 2013

This paper discusses the challenges associated with designing smaller, faster, and lower cost products. It provides an overview of Apache’s power and noise solutions and how these products enable comprehensive chip-package-system convergence flow across multiple design disciplines.

To download this white paper, click here.