• Press Release: Over 35% Revenue Growth in First Half of 2012
• Thoughts on RTL Lint, and a Poem
• Real Intent is #8 on Gary Smith’s “What to see at DAC” List!
• Gabe on EDA: Real Intent Helps Designers Verify Intent
• EDACafe: A Page is Turned

• X-FAB Offers Lowest Mask Count 700V CMOS Process in 0.35 Micrometer for Consumer-Based Power Conversion and Control Applications  May 24, 2012
• SRC and Stanford University Prove New Circuit Pattern-Design Process, See Promise for 14 Nanometer Design with Directed Self-Assembly  May 24, 2012
• UMC Holds Groundbreaking Ceremony for Fab 12A Phase 5 & 6  May 24, 2012
• Mentor DFM Analysis Service Delivers Calibre Litho Checks for TSMC 40nm and 28nm Customers  May 24, 2012
• Silicon Frontline Adds New Capabilities; Focuses on Semiconductor Power Device Reliability and Efficiency, Accurate 3D Parasitic Extraction, Point-to-Point Resistance  May 24, 2012
• Ittiam’s Wi-Fi IP Gets Strong Traction in Consumer Markets with Multi-Million Units Production  May 24, 2012
• Renesas Electronics Expands Low-Power 32-Bit RX200 Microcontroller Series Offering Scalable Lineup for Portable Consumer and Industrial Devices  May 24, 2012
• Uniquify Launches ideas2silicon Design Services Platform  May 24, 2012
• Mentor Graphics and AT&S Announce Embedded Component Package (ECP) Technology Partnership to Optimize PCB Design-Through-Manufacturing Flow  May 24, 2012
• Si2 Announces “OPS Comes to Life” Session for Si2 Roundup@DAC  May 24, 2012
• Tanner EDA Announces Tanner Analog FastSPICE  May 24, 2012
• Carbon Design Systems, Cadence Partner for IP Optimization  May 23, 2012
• Advanced Circuits Acquires Universal Circuits (UCI)  May 23, 2012
• Accellera Systems Initiative Hosts User Events at the 2012 Design Automation Conference   May 23, 2012
• Axiom Introduces Revolutionary Licensing Model For The EDA Industry  May 23, 2012
• Breker Verification Systems to Demonstrate Functional Verification Software at 49th Design Automation Conference  May 23, 2012
• OCP-IP Releases OCP 3.1 Specification into Member Review  May 23, 2012
• OCP-IP Releases New Compliance Document into Member Review  May 23, 2012
• EVE to Demonstrate ZeBu's Expanded Capabilities at 49th Design Automation Conference  May 23, 2012
• Texas Instruments Drives Adoption of Copper Wire Bonding Technology, Delivering Nearly 6.5 Billion Units to Customers  May 23, 2012
• Aldec at DAC 2012: 10 Face-to-Face Sessions  May 23, 2012
• High Power PolyPhase® Synchronous Boost Controller Features -55°C to 150°C Operating Junction Temperature Range  May 23, 2012
• Xilinx Returns to DAC Asking - Why ASIC When You Can Go All Programmable?  May 23, 2012
• Impinj Monza® X-2K and X-8K Dura Chips Deliver Exciting New Benefits to Manufacturers of Consumer Electronics  May 23, 2012
• IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing  May 23, 2012
• Analog Devices Introduces Industry’s First Analog 3-axis, High-g MEMS Accelerometer  May 23, 2012
• GLOBALFOUNDRIES Improves IC Reliability with Customized Circuit Checks Using Mentor Graphics Calibre PERC  May 22, 2012
• SMIC Employs Mentor Graphics Calibre PERC for Reliability Verification of Multi-Power Domain SoCs  May 22, 2012
• OCP-IP Delivers Enhanced Transaction Generator Package  May 22, 2012
• Real Intent's Focus on Excellent Tools for Early Functional Verification & Advanced Sign-Off for Circuit Design Results in Over 35% Revenue Growth in First Half of 2012  May 22, 2012

all news from 2012

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• Common Pitfalls in PCI Express Design

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