As shipments of wearable devices continue to rise, smartwatches have evolved to be one of the most popular devices in this sector. To make the most of a projected 42.8%
Makers can choose from multiple development platforms for the Internet of Things (IoT), many of which feature processors based on ARMÂ® design cores. Mark Woods, ARMÂ’s Applications ...
The role of Bluetooth Low Energy in embedded microcontrollers is opening up design, applications and services to users in the home and industry. Caroline Hayes (CH) asks Paul Williamson ...
Custom System on Chip (SoC) devices are becoming a cost-effective alternative to the traditional discrete IC board designs. ARM provides the DesignStart portal on its website, offering ...
Highlights from SPIE Photonics, AccelleraĂ˘â‚¬â„˘s DVCon and Automotive panels focus on semiconductor's changing role in emerging markets.
News Stories & Blog Reviews
System validation partnership; Cloudâ€™s blue sky thinking; Happy 50 th optic fiber; Back to PCIe basics; Pointing the fingerprint; Financial forecast
Mbed development board seeks therapy; in praise of HPC; IoT security â€“ can it be improved?; EDAC name change; acquisition fever runs high
Coffee breaks and C layers; Ideas for IoT security; Weather protection technology; Productivity boost; Shining a light on dark silicon
Cadence has chosen to retain the user interface of the Virtuoso custom design product while adding enhancements that make it perform as a new product.
With the growing introduction of Internet of Things (IoT) devices and applications, the issues of security and safety are becoming requirements to be verified.
2D Elastic Compression enables test time to be reduced by up to 3X without any impact on compression wirelength or fault coverage.
As tool runtimes increase and different design disciplines vie for the same compute resources, DFT poses an even greater barrier to a timely tapeout.
More predictions for 2016 dealing with specific product segments.
Instability in oil prices, the Middle East wars and the unpredictability of the Chinese market will indirectly influence the EDA industry.
At advanced nodes, the main concerns are around higher speed and lower power, which FinFET 14nm and 16nm both provide.
Whatâ€™s needed for 3D-ICs to flourish? asks Caroline Hayes, senior editor. Experts from Mentor Graphics, Altera and Synopsys have some ideas for future progress.
As the industry transitions from 2.5D to 3D-ICs, Caroline Hayes, senior editor, asked experts from Mentor Graphics, Altera and Synopsys for their view on what system designers need ...
With new roles, IoT security will become even more important. Caroline Hayes, Senior Editor, asked Steve Kester, Shantnu Sharma (both AMD), Rich Rejmaniak (Mentor Graphics) and Rob ...
Caroline Hayes, Senior Editor asked four industry experts, Carsten Elgert, Product Marketing Director, IPG (IP Group), Cadence, Tom Feist, Senior Marketing Director, Design Methodology ...
Things that seem simple often turn out not to be. Implementing IoT will not be simple because as the implementation goes forward, new and more complex opportunities will present
As we approach the DVCon conference it is timely to look at how our industry approaches managing design verification. Much has been said about the tools, but I think
By Caroline Hayes, Senior Editor The twists and turns of FinFET In an earlier Deeper Dive (Nov. 21) we looked at how TSMCâ€™s 16nm FinFET reference design was encouraging harmony ...
Graphene puts quantum computing in a spin; International super-superconductivity; Graphene structure research; China telematics changes course
There is a shift occurring in the semiconductor market, driven by the consumer space, believes Warren Savage, president and CEO, IPextreme.
The bad new is that the electronic system level (ESL) segment of the EDA market still needs more robust standards. What's the good news?
A summary of the results of a survey for developers of products in RF and analog/mixed-signal (AMS) ICs.
Electronic System-Level (ESL) design is a dynamic process but will it adapt to the changing requirements of complex IC and higher systems?
In wireless, wireline and financial big-data applications, moving all those packets needs prodigious FPGA resources, not all of which Altera had before its recent series of acquisitions, ...
Chris A. Ciufo, Editor-in-Chief Of five significant PCI Express announcements made at this weekâ€™s PCI-SIG Developers Conference, two are aimed at mobile embedded. Itâ€™s about ...
Highlights include Si-based molecular scanners; cyber-security; automotive standard ISO 26262; SPIE Photonics; DVCon
John/Sean Travelogue for March 2016 - Highlights include Si-based molecular scanners; cyber-security; automotive standard ISO 26262; SPIE Photonics; DVCon.
CAST's CEO Explains the Business vs. Technical Side of Semiconductor intellectual property (IP), especially as verification becomes a critical part of the entire IP package.
Saygus VÂ˛ (V Squared), winner of the CES 2015 Innovation Award, has 320 GB of storage, ARM-based Qualcomm Snapdragon 801, 21 MP camera, dual-boot capable, 2.5GHz quad-core processor, ...
Power-efficient ARM technology is everywhere you are, expanding your connected life.
Getting the Pebble Watch to Market. A conversation with Eric Migicovsky, Pebble founder and CEO
Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 3 of 3 "Futures", the guys discuss: adding IoT "intelligence at the node"; the Sensinode acquisition for
Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 2, the guys discuss: ARM's mbed/mbed OS and Cortex-M7; the easy path to the IoT is made