Real Intent shoots and scores for debug; DVCon takes on the world; Customized multi-core SoCs; Tech-history lesson
Recent research on the behavior of bilayer graphene brings scientists at Aarhus University, Denmark and the UKâ€™s Science and Technology Facilities Council (STFC) closer to using grapheme ...
Earlier this month, Intel announced details of the Core M processor microarchitecture, the first to be manufactured using 14nm.
In Part III, technology leaders from STMicro, Atmel, Mouser, Synopsys, Movea, and ARM, define the big challenges in IoT â€“ mixed signal, low power and security.
Best practices, standards and a diverse ecosystem are essential for embedded developers to mitigate threats such as stack overflows and software backdoors.
Cost and Complexity of designing and producing products using processes at 32 nm or smaller geometries is changing significantly how EDA companies approach the market, both with new ...
Can mixed signal designs achieve the low power needed by todayâ€™s tightly integrated SoCs and embedded IoT communication systems?
Todayâ€™s growth of analog and mixed signal circuits in IoT apps raise questions about C-code compilations, simulations, low power, latency and IP integration.
The wheels of industry roll on. Themes at Embedded World in Nuremberg were predictable, with automotive, industrial automation and IoT but there were some twists and revelations too. ...
In response to security vulnerabilities, system level designers have made the security of data and content a prime objective in our connected lives
One of the joys of todayâ€™s electronics devices is that they are connected. However connectivity and sharing files can make a system vulnerable.
Recent acquisitions and spin-offs by the major electronic design automation companyâ€™s reveals key differences in the design of complex chips.
As we approach the DVCon conference it is timely to look at how our industry approaches managing design verification. Much has been said about the tools, but I think
Connected devices like wearables highlight the business challenges faced in rolling out the Internet of Things (IoT). This is Part I of a three part story.
At CES, smart watches, networked glasses and fitness products highlighted the need for low power, connectivity and data algorithms and control.
Initial momentum in fitness and wellness may be surpassed by growth in the infotainment market. But challenges lie ahead.
Leaders of the EDA industry provide their opinions on key developments in semiconductor and electronics for 2014
Whether in tablets, wearable fitness devices or huge infotainment screens, graphics plays an important role - but there are considerations and challenges to be met.
Caroline Hayes, Senior Editor asked four industry experts, Carsten Elgert, Product Marketing Director, IPG (IP Group), Cadence, Tom Feist, Senior Marketing Director, Design Methodology ...
By Caroline Hayes, Senior Editor The twists and turns of FinFET In an earlier Deeper Dive (Nov. 21) we looked at how TSMCâ€™s 16nm FinFET reference design was encouraging harmony
David Shippy of Altera, Lawrence Loh from Jasper Design, Mentor's Steve Bailey, and Drew Wingard from Sonics got together to discuss the issues inherent in connecting IP blocks whether ...
System-Engineered Design discusses the evolution and future of design for test (DFT) with Synopsys, OptimalTest, Mentor Graphics and Cadence Design Systems.
Lattice and Xilinx muse on parallelism, partial reconfigurability, and the state-of-the-art in IP and EDA tools.
The militaryâ€™s infatuation with SWaP-C begins to drive non-defense suppliers as myriad markets and applications need better-than-commercial.
The machine-to-machine (M2M) phenomenon is accelerating and is coming to just about any connected technology near you.
Requirements for portable, low-power consumer devices, as well as energy-efficient embedded systems, drive MCU development and offer options for embedded engineers.
Cheryl CoupĂ© Fueled by new technologies, sensors have become ubiquitous, providing better user interface experiences and more natural interaction with devices. Rapid advances in MEMS ...
Cheryl CoupĂ©, Editor Machine-to-machine (M2M) capabilitiesâ€”and challengesâ€”are proliferating in transportation applications such as intelligent highway, railway control and fleet ...
A summary of the results of a survey for developers of products in RF and analog/mixed-signal (AMS) ICs.
Graphene puts quantum computing in a spin; International super-superconductivity; Graphene structure research; China telematics changes course
There is a shift occurring in the semiconductor market, driven by the consumer space, believes Warren Savage, president and CEO, IPextreme.
The bad new is that the electronic system level (ESL) segment of the EDA market still needs more robust standards. What's the good news?
Electronic System-Level (ESL) design is a dynamic process but will it adapt to the changing requirements of complex IC and higher systems?
In wireless, wireline and financial big-data applications, moving all those packets needs prodigious FPGA resources, not all of which Altera had before its recent series of acquisitions, ...
Chris A. Ciufo, Editor-in-Chief Of five significant PCI Express announcements made at this weekâ€™s PCI-SIG Developers Conference, two are aimed at mobile embedded. Itâ€™s about time. ...
Runaway complexity in design, implementation, verification and manufacturing is being mirrored across an increasingly complex supply chain. Now the question is what to do about it. ...
Chris A. Ciufo, Senior Editor Figure 1: Intel and the Linux Foundation collaborated on Tizen, an open source HTML5-based platform for smartphones, IVI, and other embedded devices. Samsung ...
Panelists from industry, national laboratories, and the Portland State System Engineering graduate program recently gathered for an open forum on model-driven engineering.
Intellitech's CEO CJ Clark explains why the latest JTAG update brings much needed capabilities to IP providers and IC developers alike.
Motion sensing applications with mm wave technology at Imec is the topic of this interview between Liesbet Van der Perre, Imec Program Director of Wireless Communication, and John Blyler, ...
Drawing on the lives of five renowned scientists, Mario Livio shows how even these geniuses made major mistakes and how their errors were an essential part of the process of
Shannon covers the last news in the semiconductor systems engineering industry and research developments for February 2014. This month's highlights include the paper brain, MEMS and ...
What are the implications of atomically precise manufacturing on today's lithography-based semiconductor fabrication? Dr. Eric Drexler from the Oxford Martin Programme at the University ...
Interview with Warren Wilson, Damper Engineer for KV Racing, during the August 2013 Indy car race at Sonoma Raceway. Wilson talked about the instrumentation challenges for the tire ...
This video is about ImagTech_Tony-King-Smith
Wally Rhines, Chairman and CEO of Mentor Graphics, talks about Moore's Law in light of the Learning Curve; 28nm as the golden node; critical need for IoT innovations; and
ARM connected keg hardware and application software demonstration provides a great segway into Freescaleâ€™s IoT exhibit.
Highlights from the IEF event in Dublin, Ireland and Imec's technology forum in Leuven, Brussels.