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Top Stories

The Search for the Executable Specification

A properly formed test suite is a way to apply Agile methods to hardware development.

EDA Tool Reduces Chip Test Time With Same Die Size

Cadence combines physically-aware scan logic with elastic decompression in new test solution. What does that really mean?

Technology Implications for 2016

More predictions for 2016 dealing with specific product segments.

Blog Review - Monday, January 25 2016

In an SoC, far, far away; A toast to FPGAs, Embedded’s new trilogy; Happy 30 th birthday, MIPS!, IoT security; Moving up with 3D; 10nm design rules

The EDA Industry Macro Projections for 2016

Instability in oil prices, the Middle East wars and the unpredictability of the Chinese market will indirectly influence the EDA industry.

News Stories & Blog Reviews

Blog Review - Monday, January 25 2016

In an SoC, far, far away; A toast to FPGAs, Embedded’s new trilogy; Happy 30 th birthday, MIPS!, IoT security; Moving up with 3D; 10nm design rules

Blog Review – Monday, January 11, 2016

As one blog has predictions for what 2016 holds, another reviews 2015. Others cover an autonomous flight drone; a taster of DesignCon 2016; Bionic leg surgery

Blog Review – Monday, December 14, 2015

Security check from ARM Techcon; IC layout nostalgia; The Why for PHY; Counterfeit measures; Why Arrow targets Python over Perl; Mentor Graphics signal integrity Q&A

Technology Features

Feature Articles

Technology Implications for 2016

More predictions for 2016 dealing with specific product segments.

The EDA Industry Macro Projections for 2016

Instability in oil prices, the Middle East wars and the unpredictability of the Chinese market will indirectly influence the EDA industry.

Advanced-Node Designs in 2016 and Beyond

At advanced nodes, the main concerns are around higher speed and lower power, which FinFET 14nm and 16nm both provide.

How to Drive a Successful IoT Application Design Project

Edge node devices in IoT are very complex systems that integrate analog and digital functions in silicon, package, and board and are controlled by software.

Mentor Graphics Comments on Signal Integrity

Mentor Graphics answers questions on signal integrity analysis

Improving Emulation Throughput for Multi-Project SoC Designs

As design sizes grow, so, too, does the verification effort. Designers must boost the emulation throughput and design team productivity to manage on time delivery and achieve performance ...

Mixed Signal Design and Verification for IoT Designs

System integration and verification is challenging for most IoT designs as they typically are a combination of two to three different IC types.

Round Tables

Deeper Dive - A 3D-IC round table - part II

What’s needed for 3D-ICs to flourish? asks Caroline Hayes, senior editor. Experts from Mentor Graphics, Altera and Synopsys have some ideas for future progress.

Deeper Dive - 3D-IC Part 1 Fri. July 11 2014

As the industry transitions from 2.5D to 3D-ICs, Caroline Hayes, senior editor, asked experts from Mentor Graphics, Altera and Synopsys for their view on what system designers need ...

Deeper Dive - IoT Security

With new roles, IoT security will become even more important. Caroline Hayes, Senior Editor, asked Steve Kester, Shantnu Sharma (both AMD), Rich Rejmaniak (Mentor Graphics) and Rob ...

Deeper Dive - Is IP reuse good or bad?

Caroline Hayes, Senior Editor asked four industry experts, Carsten Elgert, Product Marketing Director, IPG (IP Group), Cadence, Tom Feist, Senior Marketing Director, Design Methodology ...

Internet of Things (IoT) and EDA

Things that seem simple often turn out not to be. Implementing IoT will not be simple because as the implementation goes forward, new and more complex opportunities will present

Verification Management

As we approach the DVCon conference it is timely to look at how our industry approaches managing design verification. Much has been said about the tools, but I think

Deeper Dive – Dec. 05

By Caroline Hayes, Senior Editor The twists and turns of FinFET In an earlier Deeper Dive (Nov. 21) we looked at how TSMC’s 16nm FinFET reference design was encouraging harmony ...

Podcasts/Videos/Webcasts

Saygus V2 Android Smartphone

Saygus V² (V Squared), winner of the CES 2015 Innovation Award, has 320 GB of storage, ARM-based Qualcomm Snapdragon 801, 21 MP camera, dual-boot capable, 2.5GHz quad-core processor, ...

CES 2015: Expanding the Connected Experience

Power-efficient ARM technology is everywhere you are, expanding your connected life.

Interview with Pebble Watch founder

Getting the Pebble Watch to Market. A conversation with Eric Migicovsky, Pebble founder and CEO

ARM TechCon Videos: Interview with Ian Drew. Part 3: Futures.

Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 3 of 3 "Futures", the guys discuss: adding IoT "intelligence at the node"; the Sensinode acquisition for

ARM TechCon Videos: Interview with Ian Drew (Part 2: 'mbedding' the IoT)

Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 2, the guys discuss: ARM's mbed/mbed OS and Cortex-M7; the easy path to the IoT is made

ARM TechCon Videos: Interview with Ian Drew (Part 1: Servers)

Embedded editor Chris Ciufo chats with Ian Drew, CMO, ARM. ARM's move into 64-bit servers with HP's recent “Moonshot” announcement; how the IoT grows from the enterprise and handsets; ...

Why IP Providers Need the New 1149.1/JTAG

Intellitech's CEO CJ Clark explains why the latest JTAG update brings much needed capabilities to IP providers and IC developers alike.