Part of the  

Chip Design Magazine

  Network

About  |  Contact

Headlines

Headlines

Top Stories

Imec Reports Low-Power IP Blocks for 5G

Tech solutions for a smart world featured hardware and software innovations at the ITF Southwest Asian event.

Tech Travelogue June 2017 – Moore-Metcalf, IOT Chasm, Mechanical Design and 5G

Topics include the trends at DAC, Moore-Metcalf laws and the IOT Chasm, mechanical CAD in EDA and the continuing move toward systems.

Manufacturing Challenges 3D NAND Deployment

Jim Feldhan, president of Semico Research and veteran semiconductor analyst, shares his views on the challenges of moving from 2D planar to 3D NAND flash.

Silvaco - SOC Soln's Acquisition Reflect Systems Trend in IP

With completion of the Silvaco acquisition of SOC Solutions, Electronic System Design sat down with the principals from each company to talk about the future.

EDA in the Age of the System

Learn from other industries to gain a system's perspective was the reoccurring theme of Garysmith EDA analyst Laurie Balch’s pre-DAC address.

News Stories & Blog Reviews

Blog Review - Monday, September 25, 2017

This week, there are some prophecies: What does the future hold for the IoT and for vehicle design? Why is 3D facial recognition a sound idea and why the world

Blog Review – Tuesday, September 12, 2017

We have found ways to tune up the testbench from Cadence; a vision of smart cities from BDTI; the Crotian EV market; and 'back to school' means competition time!

Blog Review - Tuesday, August 29, 2017

We find trust issues for autonomous cars; Something old to wear; How to get design teams to talk; Cadence adds ARM to its library; and Explore RTOS with Mentor

Technology Features

Feature Articles

Imec Reports Low-Power IP Blocks for 5G

Tech solutions for a smart world featured hardware and software innovations at the ITF Southwest Asian event.

Manufacturing Challenges 3D NAND Deployment

Jim Feldhan, president of Semico Research and veteran semiconductor analyst, shares his views on the challenges of moving from 2D planar to 3D NAND flash.

Silvaco - SOC Soln's Acquisition Reflect Systems Trend in IP

With completion of the Silvaco acquisition of SOC Solutions, Electronic System Design sat down with the principals from each company to talk about the future.

EDA in the Age of the System

Learn from other industries to gain a system's perspective was the reoccurring theme of Garysmith EDA analyst Laurie Balch’s pre-DAC address.

Cadence Puts a Neural Network in a DSP

Cadence uses neural networks in a DSP for pattern recognition

Will Moore's and Metcalfe's Laws Cross the IOT Chasm?

The success of the IOT may depend more on a viable customer experience over the convergence of the semiconductor and communication worlds.

The Verification Times are Changing

A precursor of Portable Stimulus from Breker Verification Systems

Round Tables

Deeper Dive - A 3D-IC round table - part II

What’s needed for 3D-ICs to flourish? asks Caroline Hayes, senior editor. Experts from Mentor Graphics, Altera and Synopsys have some ideas for future progress.

Deeper Dive - 3D-IC Part 1 Fri. July 11 2014

As the industry transitions from 2.5D to 3D-ICs, Caroline Hayes, senior editor, asked experts from Mentor Graphics, Altera and Synopsys for their view on what system designers need ...

Deeper Dive - IoT Security

With new roles, IoT security will become even more important. Caroline Hayes, Senior Editor, asked Steve Kester, Shantnu Sharma (both AMD), Rich Rejmaniak (Mentor Graphics) and Rob ...

Deeper Dive - Is IP reuse good or bad?

Caroline Hayes, Senior Editor asked four industry experts, Carsten Elgert, Product Marketing Director, IPG (IP Group), Cadence, Tom Feist, Senior Marketing Director, Design Methodology ...

Internet of Things (IoT) and EDA

Things that seem simple often turn out not to be. Implementing IoT will not be simple because as the implementation goes forward, new and more complex opportunities will present

Verification Management

As we approach the DVCon conference it is timely to look at how our industry approaches managing design verification. Much has been said about the tools, but I think

Deeper Dive – Dec. 05

By Caroline Hayes, Senior Editor The twists and turns of FinFET In an earlier Deeper Dive (Nov. 21) we looked at how TSMC’s 16nm FinFET reference design was encouraging harmony ...

Podcasts/Videos/Webcasts

Tech Travelogue June 2017 – Moore-Metcalf, IOT Chasm, Mechanical Design and 5G

Topics include the trends at DAC, Moore-Metcalf laws and the IOT Chasm, mechanical CAD in EDA and the continuing move toward systems.

IOT Requires Shared Cloud and Embedded Connections

Mentor's Warren Kurisu explains how edge embedded and cloud connections (via Microsoft Azure) enables quick IOT development then demos a bio-metric game.

Hardware vs Software in IOT Security

Mike Mackey from CENTRI Technology, explains key IOT hardware-software security issues from TPM and PUFF to SSH and authentication. (IOT Devcon)

Legacy vs New IP - Trends in IOT JPG and Drone Applications

At REUSE, Meredith Lucky from CAST talked about the resurgence of legacy semi IP, parallelized JPG compressors for high def IOT and Drone system and more.

Engineering vs. Science in Public Policy

Senior policy advisor Dr. Guru Madhavan shares insights on the difference between engineering verses science and his path into the world of public policy.

Tech Travelogue Feb 2017 - FIT, Reliability and Siemens-Mentor Acquistion

Topics include the Florida Institute of Technology’s jet dragster, reliability and resilience in automotive systems and Siemens acquisition of Mentor Graphics.

Internet of Spaces for the IOT

The December 2016 monthly tech travelogue visits the Internet of Space technologies and business viability.