Hybrid graphene materials could pave the way for wearable solar cells; two teams look at magnetism; insecurity for ICs and graphene protects implants.
ARM prepares for this week’s Embedded World in Nuremberg; Duo Security looks at embedded security; Xilinx focuses on LTE IP; Ansys rejoices in fluent meshing and Imagination strives ...
Dassault Systemes at FIA; Variability has its challenges; how camera phones change our view; and eSilicon advocates waste not, want not.
I learned many things at Embedded World 2014, among which was the fact that the German word for safety and the word for security are the same (sicherheit). Only the
The high tech experience is no longer limited to one device type as capital and complexity barrier breeches allow innovation in new markets.
A panel of experts from Cadence, Mentor, NXP, Synopsys and Xilinx debate the reality and causes of the apparently widening verification gap in chip design.
In Part II of this series, semiconductor electronic leaders discuss how data-related IoT issues might disrupt organizational structures and supply chain relationships.
Console platforms move to profitability with services as mobile gaming faces challenges, while hardware technology affects software sales.
In response to security vulnerabilities, system level designers have made the security of data and content a prime objective in our connected lives
One of the joys of today’s electronics devices is that they are connected. However connectivity and sharing files can make a system vulnerable.
Recent acquisitions and spin-offs by the major electronic design automation company’s reveals key differences in the design of complex chips.
As we approach the DVCon conference it is timely to look at how our industry approaches managing design verification. Much has been said about the tools, but I think
Connected devices like wearables highlight the business challenges faced in rolling out the Internet of Things (IoT). This is Part I of a three part story.
At CES, smart watches, networked glasses and fitness products highlighted the need for low power, connectivity and data algorithms and control.
Initial momentum in fitness and wellness may be surpassed by growth in the infotainment market. But challenges lie ahead.
Leaders of the EDA industry provide their opinions on key developments in semiconductor and electronics for 2014
Whether in tablets, wearable fitness devices or huge infotainment screens, graphics plays an important role - but there are considerations and challenges to be met.
What challenges await us? I choose hardware-software co-design; cyber-physical systems; wireless chips; low power; and motivating students to high-tech.
By Caroline Hayes, Senior Editor The twists and turns of FinFET In an earlier Deeper Dive (Nov. 21) we looked at how TSMC’s 16nm FinFET reference design was encouraging harmony
David Shippy of Altera, Lawrence Loh from Jasper Design, Mentor's Steve Bailey, and Drew Wingard from Sonics got together to discuss the issues inherent in connecting IP blocks whether ...
System-Engineered Design discusses the evolution and future of design for test (DFT) with Synopsys, OptimalTest, Mentor Graphics and Cadence Design Systems.
Lattice and Xilinx muse on parallelism, partial reconfigurability, and the state-of-the-art in IP and EDA tools.
The military’s infatuation with SWaP-C begins to drive non-defense suppliers as myriad markets and applications need better-than-commercial.
The machine-to-machine (M2M) phenomenon is accelerating and is coming to just about any connected technology near you.
Requirements for portable, low-power consumer devices, as well as energy-efficient embedded systems, drive MCU development and offer options for embedded engineers.
Cheryl Coupé Fueled by new technologies, sensors have become ubiquitous, providing better user interface experiences and more natural interaction with devices. Rapid advances in MEMS ...
Cheryl Coupé, Editor Machine-to-machine (M2M) capabilities—and challenges—are proliferating in transportation applications such as intelligent highway, railway control and fleet ...
Cheryl Coupe, Managing Editor Experts discuss Intel challengers in high-performance, server-class processors, the move to 100G Ethernet and impact of new standards on ATCA-related markets. ...
A summary of the results of a survey for developers of products in RF and analog/mixed-signal (AMS) ICs.
Graphene puts quantum computing in a spin; International super-superconductivity; Graphene structure research; China telematics changes course
There is a shift occurring in the semiconductor market, driven by the consumer space, believes Warren Savage, president and CEO, IPextreme.
The bad new is that the electronic system level (ESL) segment of the EDA market still needs more robust standards. What's the good news?
Electronic System-Level (ESL) design is a dynamic process but will it adapt to the changing requirements of complex IC and higher systems?
In wireless, wireline and financial big-data applications, moving all those packets needs prodigious FPGA resources, not all of which Altera had before its recent series of acquisitions, ...
Chris A. Ciufo, Editor-in-Chief Of five significant PCI Express announcements made at this week’s PCI-SIG Developers Conference, two are aimed at mobile embedded. It’s about time. ...
Runaway complexity in design, implementation, verification and manufacturing is being mirrored across an increasingly complex supply chain. Now the question is what to do about it. ...
Chris A. Ciufo, Senior Editor Figure 1: Intel and the Linux Foundation collaborated on Tizen, an open source HTML5-based platform for smartphones, IVI, and other embedded devices. Samsung ...
Panelists from industry, national laboratories, and the Portland State System Engineering graduate program recently gathered for an open forum on model-driven engineering.
Shannon covers the last news in the semiconductor systems engineering industry and research developments for February 2014. This month's highlights include the paper brain, MEMS and ...
What are the implications of atomically precise manufacturing on today's lithography-based semiconductor fabrication? Dr. Eric Drexler from the Oxford Martin Programme at the University ...
Interview with Warren Wilson, Damper Engineer for KV Racing, during the August 2013 Indy car race at Sonoma Raceway. Wilson talked about the instrumentation challenges for the tire ...
This video is about ImagTech_Tony-King-Smith
Wally Rhines, Chairman and CEO of Mentor Graphics, talks about Moore's Law in light of the Learning Curve; 28nm as the golden node; critical need for IoT innovations; and
ARM connected keg hardware and application software demonstration provides a great segway into Freescale’s IoT exhibit.
Highlights from the IEF event in Dublin, Ireland and Imec's technology forum in Leuven, Brussels.
John Blyler from Extension Media interviews Jell De Smet, a senior researcher on smart contact lenses, Centre for Microsystems Technology (CMST), imec and Ghent University. This video ...
Here's a short clip about the Imec's stretchable, organic circuits. One potential application of this low-level light therapy (LLT) treatment for wrist Repetitive Strain Injury (RSI) ...
Extension Media's John Blyler interviews ARM's Embedded Strategist, Dominic Pajak, about the Internet-of-Things.