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Blog Review – Monday, August 14, 2017

This week, the blogsphere reveals how FPGAs adopt a MeerKAT stance; OML brings life to Industry 4.0; Wearable pairing boosts charging and rigid-flex PCB design tips

A keen advocate of rigid-flex PCB design, Alexsander Tamari, Altium, offers sound design advice for the routing challenges that it may present. There is a link to an informative white paper too.

We love wearables but charging devices wirelessly can present problems, but luckily Susan Coleman, ANYS, is able to describe the company’s recent collaboration with RF2ANTENNA. She describes with tips for efficiency improvements using its tools.

Another classic challenge is taken on by Arthur Schaldenbrand, Cadence. He continues his analog design series and looks at process variation, and countering die costs, power dissipation, with reference to the use of Monte Carlo analysis.

Chip Design’s John Blyler talks to Mentor’s Director of Product Management, Warren Kurisu, about a biometrics game and increased productivity using the Cloud.

Discovering new galaxies is exciting but is demanding on processing power and memory speeds. Steve Leibson, Xilinx, reflects on what the MeerKAR radio telescope has achieved and how FPGAs have played a part.

Ruminating on this year’s SMT Hybrid Packaging event, Danit Atar, Mentor Graphics, reviews what she claims is the world’s first IoT live public demonstration of a manufacturing line, and how Open Manufacturing Language (OML) bring Industry 4.0 to life.

Software integrity is never far from an engineer’s mind, and David Benas, Synopsys, presents a compelling argument for implementing security measures into the software development life cycle (SDLC) from start to finish.

By Caroline Hayes, Senior Editor

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