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Posts Tagged ‘3D’

Blog Review – Monday, June 12, 2017

Monday, June 12th, 2017

This week, we find traffic systems for drones and answers to the questions ‘What’s the difference between safe and secure?’ and ‘Can you hear voice control calling?’

An interesting foray into semantics is conducted by Andrew Hopkins, ARM, as he looks at what makes a system secure and what makes a system safe and can the two adjectives be interchanged in terms of SoC design? (With a little plug for ARM at DAC later this month.)

It had to happen, a traffic system designed to restore order to the skies as commercial drones increase in number. Ken Kaplan, Intel, looks at what NASA scientists and technology leaders have come up with to make sense of the skies.

Voice control is ready to bring voice automation to the smart home, says Kjetil Holstad, Nordic Semiconductor. He highlights a fine line of voice-activation’s predecessors and looks to the future with context-awareness.

More word play, this time from Tom De Schutter, Synopsys, who discusses verification and validation and their role in prototyping.

Tackling two big announcements from Mentor Graphics, Mike Santarini, looks at the establishment of the outsourced assembly and test (OSAT) Alliance program, and the company’s Xpedition high-density advanced packaging (HDAP) flow. He educates without patronizing on why the latter in particular is good news for fabless companies and where it fits in the company’s suite of tools. He also manages to flag up technical sessions on the topic at next month’s DAC.

Reporting from IoT DevCon, Christine Young, Maxim Integrated, highlights the theme of security in a connected world. She reviews the presentation “Shifting the IoT Mindset from Security to Trust,” by Bill Diotte, CEO of Mocana, and In “Zero-Touch Device Onboarding for IoT,” by Jennifer Gilburg, director of strategy, Internet of Things Identity at Intel. She explores a lot of the pitfalls and perils with problem-solving.

Anticipating a revolution in transportation, Alyssa, Dassault Systemes, previews this week’s Movin’On in Montreal, Canada, with an interview with colleague and keynote speaker, Guillaume Gerondeau, Senior Director Transportation and Mobility Asia. He looks at how smart mobility will impact cities and how 3D virtual tools can make the changes accessible and acceptable.

Caroline Hayes, Senior Editor

Research Review – Tues. June 10 2014

Tuesday, June 10th, 2014

Imec and Samsung invest in open reference sensor module; straight from the 3D heart; automotive semiconductor market accelerates; IoT becomes a reality. By Caroline Hayes, Senior Editor

Imec and Samsung Electronics are collaborating, the former contributing its Body Area Networks (BANs) technology, with Samsung’s Simband platform, which includes an open reference sensor module, integrating advanced sensing technologies from imec. Part of the Samsung digital health initiative, the sensor array can be used to develop the next generation of wearable health sensors.

Dassault Systèmes has presented the world’s first 3D realistic simulation model, based on its 3DExperience platform, of a whole human heart. It was developed with a team of cardiac experts as part of the Living Heart Project, to diagnose, treat and prevent heart conditions through personalised, 3D virtual models.

It’s full throttle for growth in the automotive semiconductor industry, says a report from Strategy Analytics. The Automotive Electronics Semiconductor Demand Forecast 2012 to 2021 predicts a strong growth of 5% CAGR over the next seven years, fuelled by green, safe, connected vehicles.

To some it’s a buzzword, but to IDC, the IoT (Internet of Things) is becoming a reality, with a worldwide market forecast predicted to exceed $7trillion by 2020. Research indicates that a transformation is underway whereby the global market for IoT solutions will grow from $1.9trillion in 2013 to $7.1trillion in 2020. The IoT is expected to find traction in homes, cars, and in businesses.

Research Review – March 25, 2014

Tuesday, March 25th, 2014

Dimension shift; solar efficiency soars; Sensors and measuring look positive; nanowires make their mark

A new semiconductor allows 3D crystals for study; fullerene-free organic photovoltaic
(OPV) multi-layer stacks boost efficiency; Berlin’s AMA Association – sensing good things in industry exports; nanoscale fingerprints defy fraud. By Caroline Hayes, Senior Editor.

Fullerene-free organic photovoltaic (OPV) multi-layer stacks have been developed by imec and claim a record conversion efficiency of 8.4%, making OPV cells a promising alternative to donor-fullerene organic solar cells.
The research team proposes a three-layer stack of two fullerene-free acceptors and a donor, arranged as discrete heterojunctions. As well as exciton dissociation at the central donor-acceptor interface, the excitons generated in the outer acceptor layer are transferred to the central acceptor, and dissociated at the donor interface, resulting in a quantum efficiency above 75% between 400 and 720nm. With an open-circuit voltage close to 1V, the 8.4 conversion efficiency figure is achieved.

Research conducted by the German-based AMA Association for Sensors and Measurement (AMA), among its members, showed a positive view of 2013 and optimistic hopes for 2014.
The annual revenue of the sensor industry shows a growth of 3%, compared with the previous year. The survey also showed the generally small and medium-sized enterprises invest 10% of their revenue in research and development.
Members’ export quota stabilized at 40% overall, with exports to other European countries rising by 3% to 25%, with the export quota to countries outside Europe dropping by 2% to 17%.
The sensor and measuring industry is investing and has augmented investments last year by an additional three percent. For the current business year 2014, AMA members reckon with an increase in investments of eight percent. This development also affects a growing demand for personnel, which rose by two percent last year.
The AMA members predict a growth in revenue of 7% for this year and a slight rise in the export quota. It also reports that sensor and measuring technology is investing heavily in research and development and counting with a further increase in personnel.

A series of fingerprint patterns with various number densities of dye-coated AgNWs.Anti-counterfeit, nanoscale fingerprints generated by randomly distributed nanowires have resulted in unique barcodes that would impractical to attempt to replicate or counterfeit.
Jangbae Kim, Je Moon Yun, Jongwook Jung Jin-Baek Kim from KAIST (Korea Advanced Institute of Science and Technology), and Hyunjoon Song and Hyotcherl Ihee from KAIST and IBS (Institute for Basic Science) Center for Nanomaterials and Chemical Reactions, report that the silver nanowires coated with fluorescent dyes, cast onto the surface of transparent PET film, produce non-repeatable patterns characterized by the random location of the nanowires and their fluorescent colors. These unique barcodes makes counterfeiting such a pattern impractical and expensive; the cost of replicating it would be higher than the value of the typical target item being protected. The patterns can be authenticate, using an optical microscope.

Nano-beam electron diffraction pattern of rhenium disulfide with a zoom-in insert image reveals a quasi-hexagonal reflection pattern.Paving the way for 2D electronic applications with a 3D material, the discovery of a new semiconductor, rhenium disulfide by Berkeley Lab’s Molecular Foundry, could also make it possible to study 2D physics with 3D crystals, created using rhenium disulfide.
Rhenium disulfide, unlike molybdenum disulfide and other dichalcogenides, behaves electronically as if it were a 2D monolayer even as a 3D bulk material. Junqiao Wu, a physicist with Berkeley Lab’s Materials Sciences Division, explained that its photoluminescence intensity increases while its Raman spectrum is unchanged, even with an increasing numbers of layers, ideal for probing 2D excitonic and lattice physics, without preparing large area, single crystal monolayers.

Blog Review – March 10 2014

Monday, March 10th, 2014

By Caroline Hayes, Senior Editor

Dassault takes to the stage; DVCon keynote urges apps take-up; Getting smart about smart products; Mentor’s Automotive Open Source event; ARM graphic is a water cooler moment; advocating early software development.

First the Oscars, now the SXSW Interactive Festival. Elena tells how Dassault Systèmes will appear in Austin, Texas for the second year in a row, showcasing 3D technologies in a theatre stage setting. Lights, camera, action!

At this year’s DVCon, Brian Fuller relates how Cadence CEO Lip-Bu Tan advocates social media and apps development in the engineering ecosystem in his keynote speech of the event.

Be warned, Todd McDevitt Ansys, has a lot to say about Systems Engineering for Smart Products and he makes a great start in this first of a series of blogs explaining the evolution of MBSE ( model-based systems engineering).

If you have a window in your diary for tomorrow, Matt Radochonski, Mentor Graphics, encourages you to attend the Silicon Valley Automotive Open Source event Security and Performance Benefits of Automotive Virtualization. He helpfully provides an abstract from colleague Felix Baum’s presentation to whet your appetite.

Someone at ARM has clearly had trouble communicating with engineers. Karthik Ranian supplies a humorous pie chart summarizing their foibles. Never has a single graphic attracted so many comments – and judgments.

For those struggling with early software development, single-minded Michael Posner offers advice on Synopsys virtual prototyping and hybrid prototyping tools to get the message across that you can never plan too early. It may not be an all-encompassing round up but some of the graphics are effective.

WEEK IN REVIEW: October 3 2013

Friday, October 4th, 2013

Caroline Hayes

Fujifilm and imec have developed photoresist technology for organic semiconductors that enables submicron patterning on large substrates, without damage to the organic materials. It could prove to be a cost-effective alternative to current methods, i.e. shadow masking and inkjet printing, which have not proved suitable for high resolution patterns on large substrates. Photolithography is successfully used in patterning silicon semiconductors, but the photoresist dissolves the organic semiconductor material during processing. OPDs (organic photo detectors) were produced at sizes down to 200µm x 200µm without degradation. OLED (organic light emitting diodes) were also produced, at a pitch of 20µm and were found to emit uniform light.

Synopsys released a new TLM (transaction level model) subsystem flow and eclipse IDE (integrated development environment) integration speed Virtualizer Development Kit. The Virtualizer 13.06 enables and disables components of the design to allow users to optimize simulation performance during software debug.

Celebration for Cadence Design Systems as it accepted not one but three Partner of the Year awards from TSMC at this month’s Open Innovation Platform forum. They were for the Analog/Mixed-Signal IP, the 16nm FinFET Design Infrastructure, and Joint Delivery of 3D-IC Design Solution categories.

NAND flash devices are looking beyond conventional semiconductor manufacturing techniques, reports IHS. Nearly two thirds (65.2%) of all NAND memory chips shipped worldwide by 2017, will be produced using 3D processes, according to a Flash Dynamics brief. At present, it is less than 1%. Time is running out for planar semiconductor technology capacity, leaving 3D manufacturing the answer to building higher densities NAND products.

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