An interesting and informative tutorial on connecting Ardino to the Internet when ‘in the wild’ is the topic that caught ARM’s Joe Hanson’s interest.
Sharing the secrets of SoC companies that accelerate the distributed design process, Kurt Shuler, Arteris, considers the interconnect conundrum.
Never one to shy away from the big question, Richard Goering, Cadence Design Systems, asks what is the key to IC design efficiency. He has some help, with panel members from the DVCON 2015 conference, organised by the Accellera Systems Initiative.
Contemplating NXP’s acquisition of Freescale, Ray Angers, Chip Works, and, with a series of bar charts and dot-graphics, deems the Euro-American couple a good match.
Experiencing an identity crisis, Jeff Bier, Berkley Design, is looking forward to attending Embedded Vision Summit, in May, and particularly, it seems, to the keynote by Mike Aldred, the lead robotics developer at Dyson.
The multi-lingual Colin Walls is brushing up on his Swedish as he packs for ESC (Embedded Conference Scandinavia) this week. He will speak at three sessions – Dynamic Memory Allocation and Fragmentation in C and C++, Power Management in Embedded Systems and Self-Testing in Embedded Systems, which he previews in this blog.
Delighted at Intel’s call for 3D IC, Zvi Or-Bach, MonolithIC 3D, argues that the packaging technology for SoCs, using data and graphics from a variety of sources.
Blogging from Mobile World Congress, Martijn van der Linden, NXP, looks at what the company is developing for the Internet of Things, including the connected, Tesla, car concept from Rinspeed.
Anyone looking into serial data transfers to replace parallel data transfer, can discover more from the blog, posted by Saurabh Shrivastava, Synopsys. The acceleration of PCI Express based systems’ verification and the difference power states of the interface has never been more relevant.