When everyone hits the shops, some bloggers want to see presents fall from the sky. This week there is also a sleek design project, new uses for SoCs, an Arduino project (with video) a hypervisor discussion and a summit review.
Coffee breaks and C layers; Ideas for IoT security; Weather protection technology; Productivity boost; Shining a light on dark silicon
IP fingerprinting; Beware- 5G!; And the award goes to – encryption; Fear of FinFET; Smart kids; Virtual vs real hardware
Although the venue was the German city of Nuremberg, there was a distinctive coterie of French companies at Embedded World, writes Caroline Hayes, senior editor.
Traditional EDA vendors are late in supporting one side of the electronics industry: software development. Although much is being said about system-level support and hardware/software co-design, the work has been left to companies like Altera, ARM®, Xilinx and others to develop software development tools.
ARM®’s Embedded Strategist Dominic Pajak talks about the latest innovations and why Makers are choosing ARM technology.
A fourth stage in the evolution of TrustZone® is a new market for security hardened apps.
European semiconductor company STMicroelectronics has announced sampling of the world’s first ARM® Cortex®-M7 based 32-bit MCU, the STM32 F7 series.
ARM® keeps to the core, building fundamental tools for everything in its line-up
Internet of Things (IoT) devices ranged from Bluetooth gateways and smart sensors to intensive cloud-based data processors and hackathons – all powered by ARM.
Videos/PodcastsHighlights include Si-based molecular scanners; cyber-security; automotive standard ISO 26262; SPIE Photonics; DVCon
Business vs. Tech Side of Semi IP
Low Power Engineering
Trends in Hyper-Spectral Imaging, Cyber-Security and Auto Safety Highlights from SPIE Photonics, Accelleraâs DVCon and Automotive panels focus on semiconductor's...
Fit-for-Purpose Tools Needed for ISO 26262 Certification Both the product development process and third-party tool âfit-for-purposeâ certification...
- Renuka: So true for embedding sustainability aspects right from design mode.
- Dennis Brophy: I’m not certain I ever questioned an online offering for technical information coming out of...
- Jeff Brower: Chris- Your analysis is very good. I have been using your blog post since last year for reference in...
- Justin Nescott: It’s a honor to be included in your blog review. I’m glad you found the ANSYS Top 5...
- Daniel Payne: I think there’s a typo in the third paragraph with “0.07V”, should instead be 0.7V....
Jim Kobylecky Besides, eating a coding rivet from time to time has to be a whole lot less painful than the alternative. Hmm,...
Srini What a great prediction/foresight Gabe! We have indeed DVCon happening in India this year, 2014, intact little...
jblyler Hi Steve. Thx for the correction. I mentioned it to the editor and updated the post. Cheers. -- John
Windy Windy... DAC 2013 Pictures | JB's Circuit...
An interconnect, also referred to as a bus matrix or fabric, serves as the communication hub of multiple intellectual property (IP) cores inside a system on chip (SoC). As the capacity of today’s SoCs continues to increase dramatically…
Finding the optimal configuration options that meet the requirements of a particular system requires complementary design tools to enable the designer to rapidly explore and correlate trade-offs in performance, power, and area (PPA).
The recent advent of low-cost cluster management offerings have allowed IT organizations to adopt failover techniques for a variety of mission-critical systems, including the ENOVIA Synchronicity DesignSync Design Data Management (DDM) product from Dassault Systèmes. This paper provides a detailed example developed with a current semiconductor customer.
When templates, methodologies and verification IP components were integrated, suddenly simulation speed took a nosedive. Here’s why.
A new method for dramatically reducing CPU and RAM resource requirements.
New techniques that are making advanced SoC verification possible.
The relative advantages and disadvantages of single-threaded tag and multi-threaded non-blocking protocols.
A trove of technical videos and presentations from Cadence and other companies.
RTL flows are straining to meet the demands of most product teams. Moving up a level of abstraction is no longer an option.
A new design methodology is needed for rapid layout prototyping, in-design signoff and to improve collaboration between schematic and layout designers.