First of three parts: Hardware-software co-design; raising the level of abstraction; pathfinding; finding commonality between designs and increasing re-use; modeling languages.

Second of three parts: Abstractions, re-use, balancing time-to-market with exploration, the role of software, how to build differentiation into designs.

Last of three parts: Faster derivatives; differentiation that matters; standards; multivendor tools vs. single-vendor integration; tradeoffs in stacked die.

First of three parts: The different roles of 2.5D and 3D; progress over the past couple years; 2D vs. stacked approaches; progress on stacked die standards.

Second of three parts: Supply chain changes; testing issues in 2.5D and 3D; what’s missing from the EDA tools arsenal; dealing with an increase in physical effects.

Last of three parts: What tools are needed; stress tests in 3D; hardware-software co-design; who aggregates the stack; risk, responsibility and rewards.

First of three parts: Issues in FPGA prototypes; why it’s becoming more popular; what still needs to be addressed by the EDA industry; choosing the right tool for the job.

Second of three parts: The goal of prototyping; creating a bridge between analog, digital and software engineers to pinpoint problems.

Last of three parts: Measuring the impact of power and software on a design; commercial tools vs. homegrown prototyping systems; the role of prototyping in 3D stacked die designs.

First of three parts: Defining ESL, its uses and its limitations; challenges for keeping models in sync; matching low-level and high-level models.

What’s working and what isn’t at advanced nodes for stacked die configurations.

The move to both fully-depleted SOI and FinFETs may be inevitable over the next couple process nodes, regardless of which one comes first.

Sonics CEO Grant Pierce looks at what needs to change in SoC design, what’s driving those changes, and how all of this will be affected by 2.5D and 3D stacking.

What are the design challenges of the leading GPU company and how are they changing?

Bernard Murphy digs down into what’s changing in semiconductor design and how 3D stacking will affect it.

A look at the next big thing in semiconductors and technology and what it’s going to take to get there.

Open-Silicon’s CEO talks about priorities in business and technology, and how to bring them together.

eSilicon’s CEO sounds off on changes in the supply chain, the skills needed to design a chip at 28nm and the promise of stacked die.

A view from the top at Mentor Graphics into how technology, business and system-level design are changing.

A look at how the growing challenge in verifying complex SoCs and why it’s getting tougher to solve this problem.