What we used to consider a design start will need to change. What do you call an SoC with extensive IP re-use?

The real challenge will be in the assembly of block and subsystems, not in the creation of them.

An industry in transition is much more difficult to predict than one that is more mature. Even putting the past into perspective will take time.

While chipmakers historically shunned the idea of paying for services, they may not have a choice.

There isn’t a whole lot that’s new even in stacked die. The biggest changes will be on the business side.

Business changes are forcing companies to examine advanced research much more closely.

To say that history repeats itself is to miss some of the really interesting changes.

More granular processors and components will change the design process and the user experience.

The push into advanced geometries and new challenges is prompting far more tool sales than in the past.

The real challenge in stacking die isn’t the technology. It’s the business of technology.