eSilicon STAR platform delivers enhanced user experience and new capabilities that leverage IC design virtualization technology
Technology Features Archive
Internet of Things (IoT) devices ranged from Bluetooth gateways and smart sensors to intensive cloud-based data processors and hackathons – all powered by ARM.
Experts from ARM, Mathworks, Cadence, Synopsys, Analog Devices, Atrenta, Hillcrest Labs and STMicroelectronics cook-up ways to integrate analog with IoT buses.
When can hardware be considered as software? Are software flows less complex? Why are hardware tools less up-to-date? Experts from ARM, Jama Software and Imec propose the answers.
Low Power Design is now the main stream in IC development. There is no more a separation between plugged-in circuits and battery powered devices.
DFT is a key component of IC design. The technology is evolving to include architecture and algorithms development. Standards play a key role as well.
Earlier this month, Intel announced details of the Core M processor microarchitecture, the first to be manufactured using 14nm.
Recent research on the behavior of bilayer graphene brings scientists at Aarhus University, Denmark and the UK’s Science and Technology Facilities Council (STFC) closer to using grapheme in transistors, and other, alternative energy devices, writes Caroline Hayes, Senior Editor.
What’s needed for 3D-ICs to flourish? asks Caroline Hayes, senior editor. Experts from Mentor Graphics, Altera and Synopsys have some ideas for future progress.
As the industry transitions from 2.5D to 3D-ICs, Caroline Hayes, senior editor, asked experts from Mentor Graphics, Altera and Synopsys for their view on what system designers need to consider in implementing 3D-ICs.
Videos/PodcastsHighlights include Si-based molecular scanners; cyber-security; automotive standard ISO 26262; SPIE Photonics; DVCon
Business vs. Tech Side of Semi IP
Low Power Engineering
Trends in Hyper-Spectral Imaging, Cyber-Security and Auto Safety Highlights from SPIE Photonics, Accelleraâs DVCon and Automotive panels focus on semiconductor's...
Fit-for-Purpose Tools Needed for ISO 26262 Certification Both the product development process and third-party tool âfit-for-purposeâ certification...
- Renuka: So true for embedding sustainability aspects right from design mode.
- Dennis Brophy: I’m not certain I ever questioned an online offering for technical information coming out of...
- Jeff Brower: Chris- Your analysis is very good. I have been using your blog post since last year for reference in...
- Justin Nescott: It’s a honor to be included in your blog review. I’m glad you found the ANSYS Top 5...
- Daniel Payne: I think there’s a typo in the third paragraph with “0.07V”, should instead be 0.7V....
Jim Kobylecky Besides, eating a coding rivet from time to time has to be a whole lot less painful than the alternative. Hmm,...
Srini What a great prediction/foresight Gabe! We have indeed DVCon happening in India this year, 2014, intact little...
jblyler Hi Steve. Thx for the correction. I mentioned it to the editor and updated the post. Cheers. -- John
Windy Windy... DAC 2013 Pictures | JB's Circuit...
An interconnect, also referred to as a bus matrix or fabric, serves as the communication hub of multiple intellectual property (IP) cores inside a system on chip (SoC). As the capacity of today’s SoCs continues to increase dramatically…
Finding the optimal configuration options that meet the requirements of a particular system requires complementary design tools to enable the designer to rapidly explore and correlate trade-offs in performance, power, and area (PPA).
The recent advent of low-cost cluster management offerings have allowed IT organizations to adopt failover techniques for a variety of mission-critical systems, including the ENOVIA Synchronicity DesignSync Design Data Management (DDM) product from Dassault Systèmes. This paper provides a detailed example developed with a current semiconductor customer.
When templates, methodologies and verification IP components were integrated, suddenly simulation speed took a nosedive. Here’s why.
A new method for dramatically reducing CPU and RAM resource requirements.
New techniques that are making advanced SoC verification possible.
The relative advantages and disadvantages of single-threaded tag and multi-threaded non-blocking protocols.
A trove of technical videos and presentations from Cadence and other companies.
RTL flows are straining to meet the demands of most product teams. Moving up a level of abstraction is no longer an option.
A new design methodology is needed for rapid layout prototyping, in-design signoff and to improve collaboration between schematic and layout designers.