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eSilicon Launches Integrated ASIC Design And Manufacturing Platform

eSilicon STAR platform delivers enhanced user experience and new capabilities that leverage IC design virtualization technology

Smart Bluetooth, Sensors and Hackers Showcased at CES 2015

Internet of Things (IoT) devices ranged from Bluetooth gateways and smart sensors to intensive cloud-based data processors and hackathons – all powered by ARM.

IoT Cookbook: Analog and Digital Fusion Bus Recipe

Experts from ARM, Mathworks, Cadence, Synopsys, Analog Devices, Atrenta, Hillcrest Labs and STMicroelectronics cook-up ways to integrate analog with IoT buses.

Is Hardware Really That Much Different From Software?

When can hardware be considered as software? Are software flows less complex? Why are hardware tools less up-to-date? Experts from ARM, Jama Software and Imec propose the answers.

Low Power Is The Norm, Not The Exception

Low Power Design is now the main stream in IC development. There is no more a separation between plugged-in circuits and battery powered devices.

What Is Not Testable Is Not Fixable

DFT is a key component of IC design. The technology is evolving to include architecture and algorithms development. Standards play a key role as well.

Deeper Dive – Intel’s 14nm – August 29, 2014

Earlier this month, Intel announced details of the Core M processor microarchitecture, the first to be manufactured using 14nm.

Deeper Dive – Graphene Research – Aug. 27 2014

Recent research on the behavior of bilayer graphene brings scientists at Aarhus University, Denmark and the UK’s Science and Technology Facilities Council (STFC) closer to using grapheme in transistors, and other, alternative energy devices, writes Caroline Hayes, Senior Editor.

Deeper Dive – A 3D-IC round table – part II

What’s needed for 3D-ICs to flourish? asks Caroline Hayes, senior editor. Experts from Mentor Graphics, Altera and Synopsys have some ideas for future progress.

Deeper Dive – 3D-IC Part 1 Fri. July 11 2014

As the industry transitions from 2.5D to 3D-ICs, Caroline Hayes, senior editor, asked experts from Mentor Graphics, Altera and Synopsys for their view on what system designers need to consider in implementing 3D-ICs.