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IN THIS ISSUE — January 26, 2012
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Will It Work?
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Third-party IP, increased complexity, parasitic effects and software are making the verification challenge more difficult. Can this be fixed?
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Reverse Engineering
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Manufacturing limitations and challenges increasingly will dictate what happens in IC design; more collaboration will be required across the supply chain.
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Ambient Computing: Interdependencies Rule
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Computers that are always ready, smart enough to anticipate what you want, aren't science fiction anymore. But they do change the definition of a system.
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Experts At The Table: Changing Design
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Hardware-software co-design; raising the level of abstraction; pathfinding; finding commonality between designs and increasing re-use; modeling languages.
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The Wi Of CES
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Moving data will require significant infrastructure improvements; available wireless spectrum remains an issue.
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Model Report Card
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What's available, what's missing, and what's in development, and how models are being used inside STMicroelectronics.
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More Top Stories
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Editor's Note
Redefining Design Starts
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What we used to consider a design start will need to change. What do you call an SoC with extensive IP re-use?
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ESL Edge
Power Matters
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What's obvious to some engineers is obviously wrong to others, and that's a problem.
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A View from the Top
Model Behavior
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What makes one model better than another? A look at how to build models for less money and with higher user value.
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The Way IC It
Turducken Lessons
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What you can learn about complex ASICs from a weird holiday food combination.
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The Early Edition
Way, Way Beyond CES
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Forget bigger TVs and smaller tablets. Think exoskeletons and bionic eyes.
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The Traffic Cop
New Electronic World Order
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The move to SoCs has made semiconductors suddenly much more interesting. It also has changed the stakes in technology.
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Pallab's Place
Interfaces dominate CES IP
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At the 2012 CES conference, there were many IP providers mixed in amongst the many end product companies. These IP providers were showing capabilities as a well as ASSP products targeting the mobile community and handheld products.
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 | | | What's working and what isn't at advanced nodes for stacked die configurations. | |  | |
| | | The move to both fully-depleted SOI and FinFETs may be inevitable over the next couple process nodes, regardless of which one comes first. | |  | |
| | | Sonics CEO Grant Pierce looks at what needs to change in SoC design, what's driving those changes, and how all of this will be affected by 2.5D and 3D stacking. | |
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More Videos/Podcasts
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